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ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement

　　Kyoto, Japan and Geneva, Switzerland, April 22, 2024 – ROHM (TSE: 6963) and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced today the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company. The new multi-year agreement governs the supply of larger volumes of SiC substrate wafers manufactured in Nuremberg, Germany, for a minimum expected value of $230 million.　　Geoff West, EVP and Chief Procurement Officer, STMicroelectronics, commented “This expanded agreement with SiCrystal will bring additional volumes of 150mm SiC substrate wafers to support our devices manufacturing capacity ramp-up for automotive and industrial customers worldwide. It helps strengthen our supply chain resilience for future growth, with a balanced mix of in-house and commercial supply across regions”.　　“SiCrystal is a group company of ROHM, a leading company of SiC, and has been manufacturing SiC substrate wafers for many years. We are very pleased to extend this supply agreement with our longstanding customer ST. We will continue to support our partner to expand SiC business by ramping up 150mm SiC substrate wafer quantities continuously and by always providing reliable quality”. said Dr. Robert Eckstein, President and CEO of SiCrystal, a ROHM group company.　　Energy-efficient SiC power semiconductors enable electrification in the automotive and industrial sectors in a more sustainable way. By facilitating more efficient energy generation, distribution and storage, SiC supports the transition to cleaner mobility solutions, lower emissions industrial processes and a greener energy future, as well as more reliable power supplies for resource-intensive infrastructure like data centers dedicated to AI applications.　　About STMicroelectronics　　At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027.　　Further information can be found at www.st.com .　　About ROHM　　Founded in 1958, ROHM provides ICs and discrete semiconductor devices characterized by outstanding quality and reliability for a broad range of markets, including automotive, industrial equipment and consumer market via its global development and sales network.　　In the analog power field, ROHM proposes the suitable solution for each application with power devices such as SiC and driver ICs to maximize their performance, and peripheral components such as transistors, diodes, and resistors.　　Further information on ROHM can be found at www.rohm.com .　　About SiCrystal　　SiCrystal, a ROHM group company, is one of the global market leaders for monocrystalline silicon carbide wafers. SiCrystal’s advanced semiconductor substrates provide the basis for the highly efficient use of electrical energy in electric vehicles, fast charging stations, renewable energies and in various fields of industrial applications.　　Further information on SiCrystal can be found at www.sicrystal.de .

Key word：

ROHM

Release time：2024-04-24 11:10 reading：355 Continue reading>>

Trade news

Earthquake Temporarily Halts Silicon Wafer, MLCC, and Semiconductor Facilitie sin Japan, Impact Expected to be Controllable, Says TrendForce

　　TrendForce’s investigation into the impact of the recent strong earthquake in the Noto region of Ishikawa Prefecture, Japan, reveals that several key semiconductor-related facilities are located within the affected area. This includes MLCC manufacturer TAIYO YUDEN, silicon wafer (raw wafer) producers Shin-Etsu and GlobalWafers, and fabs such as Toshiba and TPSCo (a joint venture between Tower and Nuvoton).　　Given the current downturn in the semiconductor industry and the off-peak season, along with existing component inventories and the fact that most factories are located in areas with seismic intensities of level 4 to 5—within the structural tolerance of these plants—preliminary inspections indicate no significant damage to the machinery, suggesting the impact is manageable.　　In terms of silicon wafer production, Shin-Etsu and GlobalWafers' facilities in Niigata are currently shut down for inspection. The crystal growth process in raw wafer manufacturing is particularly sensitive to seismic activity. However, most of Shin-Etsu's crystal growth operations are primarily in the Fukushima area, thus experiencing limited impact from this earthquake. SUMCO reported no effects.　　On the semiconductor front, Toshiba's Kaga facility in the southwestern part of Ishikawa Prefecture is currently undergoing inspections. This site includes a six-inch and an eight-inch factory, along with a twelve-inch facility slated for completion in the 1H24. Additionally, the three TPSCo factories in Uozu, Tonami, and Arai—co-owned by Tower and Nuvoton (formerly Panasonic)—are all undergoing shutdowns for inspections. In contrast, USJC (UMC's acquisition of the Mie Fujitsu plant area in 2019) was not affected.　　MLCC manufacturer TAIYO YUDEN’s new Niigata plant, designed to withstand seismic activity up to level 7, reported no equipment damage. Murata (MLCC fabs only) and TDK’s MLCC plants experienced seismic intensities below level 4 and were not notably affected. However, Murata’s other factories (Non-Production MLCC) in Komatsu, Kanazawa, and Toyoma, which are in the areas with seismic intensity above 5, were closed for the New Year holiday, and staff are currently assessing any damage.

Key word：

earthquake

Release time：2024-01-03 16:49 reading：1439 Continue reading>>

Trade news

STMicroelectronics to Invest EUR 5 Billion in New SiC Wafer Fab

　　STMicroelectronics, following its EUR 7.5 billion wafer fab project with GlobalFoundries in Crolles, France. is set to invest EUR 5 billion in building a new SiC super semiconductor wafer fab in Catania, Sicily, Italy. The fab in Italy will specialize in producing SiC chips, a pivotal technology for electric vehicles with substantial growth potential, according to French media L’Usine Nouvelle on November 26th,　　STMicroelectronics competitively plans to transition to 8-inch wafers starting from 2024. The company will integrate Soitec’s SmartSiC technology to enhance efficiency and reduce carbon emissions. Simultaneously, STMicroelectronics aims to increase capacity, achieve internal manufacturing, and collaborate with Chinese firm Sanan Optoelectronics to raise SiC chip-related revenue from the expected USD 1.2 billion in 2023 to USD 5 billion by 2030.　　On June 7th earlier this year, STMicroelectronics and Sanan Optoelectronics announced a joint venture to establish a new 8-inch SiC device fab in Chongqing, China, with an anticipated total investment of USD 3.2 billion.　　To ensure the successful implementation of this extensive investment plan, Sanan Optoelectronics said to utilize its self-developed SiC substrate process to construct and operate a new 8-inch SiC substrate fab independently.　　TrendForce: over 90% SiC market share by major global players　　According to TrendForce, the SiC industry is currently dominated by 6-inch substrates, holding up to 80% market share, while 8-inch substrates only account for 1%. Transitioning to larger 8-inch substrates is a key strategy for further reducing SiC device costs.　　8-inch SiC substrates offer significant cost advantages than 6-inch substrates. The industry’s major players in China, including SEMISiC, Jingsheng Mechanical & Electrical Co., Ltd. (JSG), Summit Crystal, Synlight Semiconductor, KY Semiconductor, and IV-SemiteC, are advancing the development of 8-inch SiC substrates. This shift from the approximately 45% of total production costs associated with substrates is expected to facilitate the broader adoption of SiC devices and create a positive cycle for major companies.　　Not only Chinese companies but also international semiconductor giants like Infineon Technologies and Onsemi are actively vying for a share of the market. Infineon has already prepared the first batch of 8-inch wafer samples in its fab and plans to convert them into electronic samples soon, with mass production applications scheduled before 2030. International device companies like Onsemi and ROHM have also outlined development plans for 8-inch SiC wafers.　　Currently, major companies hold over 90% of the market share, intensifying competition. A slowdown in progress could provide opportunities for followers. According to TrendForce, the market share of the top 5 SiC power semiconductor players in 2022 was dominated by STMicroelectronics (36.5%), Infineon (17.9%), Wolfspeed (16.3%), Onsemi (11.6%), and ROHM (8.1%), leaving the remaining companies with only 9.6%.

Key word：

STMicroelectronics

Release time：2023-11-30 10:53 reading：1726 Continue reading>>

Trade news

Industry-Wide Price Decline: Wafers and Cells Experience Accelerated Rate

　　Polysilicon　　Polysilicon prices continue to decline throughout the week, with sluggish turnover. The mainstream concluded price for mono recharge polysilicon is RMB 72/KG, while mono dense polysilicon is priced at RMB 75/KG and N-type polysilicon is currently priced at RMB 85/KG.　　On the supply side, new production capacity is consistently being added, leading to a significant increase in actual output. However, demand in the market has been sluggish due to cautious downstream customers. Polysilicon inventory has been accumulating since this month and is expected to reach between 30,000 and 50,000 tons by the end of this month.　　Turning to the demand side, profits for wafer manufacturers have plummeted to their lowest levels. Furthermore, crystal pulling manufacturers, who already have high inventory and anticipate declining polysilicon prices, have been reducing their purchase frequency to exert pressure on polysilicon companies to lower their prices.　　This week, market order volumes remain sluggish, and the ongoing battle between polysilicon manufacturers and crystal pulling manufacturers persists. However, as polysilicon inventory continues to rise, the support for polysilicon manufacturers to maintain their prices weakens. It’s evident that they will eventually have to lower polysilicon prices and sacrifice some of their profits.　　Wafer　　The prices of wafer have still reduced throughout the week. The mainstream concluded price for M10 wafer is RMB 2.40/Pc, while G12 wafer is priced at RMB 3.40/Pc.　　On the supply side, with wafer inventory remaining high and minimal growth in downstream customer demand, coupled with the recent decline in polysilicon prices, crystal pulling manufacturers find themselves compelled to scale back their production rates in order to alleviate the surplus supply. Conversely, on the demand side, cell manufacturers have not yet taken measures to reduce their output. However, the demand for modules downstream remains weak, intensifying the pressure they face due to excessive inventory. It is highly likely that they will need to lower their production rates in the near future to tackle the high inventory issue. This week, wafer prices have continued their downward trend, and the rate of decline has increased compared to last week. If there is no substantial boost in downstream customer demand, wafer prices are expected to persist in their descent.　　Cell　　Cell prices have still declined this week. The mainstream concluded price for M10 cell is RMB 0.51/W, while G12 cell is priced at RMB 0.53/W. The price of M10 mono TOPCon cell is RMB 0.52/W.　　On the supply side, there are no indications that the production rates among cell manufacturers will decrease. However, downstream module manufacturers are expected to reduce their purchasing demand, which is putting increased pressure on specialized cell manufacturers regarding their shipments. In terms of cell types, the presence of less efficient N-type cells in the market has led to price discrepancies and resulting chaos. This has made it more challenging to ship N-type cells.　　This week, the rate of decline in N-type cells has increased compared to last week, which is narrowing the price gap between P-type and N-type cells. On the demand side, the production rates of module manufacturers have remained constant. However, due to mounting cost pressures, specialized module manufacturers are displaying stronger signs of reducing their output and are slowing down their raw material purchases. With upstream product prices dropping and weaker downstream demand, there is insufficient support for cell prices. This week, prices for different cell types are declining, and the rate of decline is decreasing further.　　Module　　Module prices have gone down slightly throughout the week. The mainstream concluded price for 182mm facial mono PERC module is RMB 1.15/W, 210mm facial mono PERC module is priced at RMB 1.16/W, 182mm bifacial glass PERC module at RMB 1.16/W, and 210mm bifacial glass PERC module at RMB 1.17/W.　　On the supply side, module manufacturers are maintaining their production rates, but there’s a divergence in their production schedules. First-tier module manufacturers still have ample orders to keep their operations running at full capacity, while specialized manufacturers are reducing their production schedules due to increased costs and lower order volumes. Additionally, specialized manufacturers are cutting back on their cell purchases.　　On the demand side, module prices continue to decline, which has led to growing concerns in the overseas market regarding the diminishing value of modules. Consequently, they are slowing down their purchasing pace and focusing on depleting their substantial inventory. On the domestic front, the demand for modules is expected to decline as the peak season for ground-based installations comes to an end. Future demand hinges on the marginal changes in distributed PV installations. Currently, demand is sluggish, and with upstream product prices decreasing, the cost-side support is weakening. As a result, module prices are experiencing a slight decline.

Key word：

wafer

Release time：2023-10-26 16:50 reading：1237 Continue reading>>

Trade news

TSMC’s 3nm Capacity Hits 100,000 Wafers Next Year, Driven by New Projects

　　According to a report by Money DJ, there’s good news from TSMC regarding its 3nm node. Sources within the supply chain have disclosed that the number of new chip designs using the 3nm process, known as “New Tape-Outs” (NTOs), has surged. It’s confirmed that customers including MediaTek, AMD, NVIDIA, and Qualcomm will follow in Apple’s footsteps for mass adoption of the 3nm process in the next year (2024) and the subsequent year. By the second half of next year, the monthly production capacity for the 3nm family, including N3E, will increase from the current approximately 60,000 wafers to 100,000 wafers.　　According to publicly available information from TSMC, the company began volume production of its first 3nm process node, N3, in the second half of last year. The enhanced version of the 3nm process, N3E, started production in the latter half of this year. There will also be extensions to the 3nm process, including N3P, N3S, and N3X. This year, Apple’s high-end A17 Pro chip for its iPhones was based on the initial N3 process.　　Both TSMC and MediaTek previously announced their collaboration, with MediaTek developing new Dimensity products using TSMC’s 3nm process. The design phase, known as “Tape Out,” has been successfully completed, and mass production is scheduled for next year. Industry reports indicate that aside from Apple and MediaTek, AMD, NVIDIA, and Qualcomm are also confirmed to adopt the N3 family of processes. Intel is also on the list, with mass production planned for the year after next.　　TSMC’s first-generation 3nm process currently has a monthly production capacity of about 60,000 wafers, serving Apple as its primary customer. TSMC has initiated a program known as “Continuous Improvement Plan” (CIP) for the 3nm process, referred to as N3B in the industry. Supply chain sources suggest that N3B’s capacity will be integrated into subsequent extended process nodes, such as N3E, which is expected to attract more customers. It is estimated that the overall 3nm monthly production capacity will reach 100,000 wafers by the second half of next year.

Key word：

chip

Release time：2023-09-25 15:48 reading：1416 Continue reading>>

Trade news

8-Inch Wafer Fabs to Increase Monthly Production Capacity by 14% in 2026

　　Source to China Times, the International Semiconductor Industry Association (SEMI) forecasts that from 2023 to 2026, the global semiconductor industry will add 12 new 8-inch wafer fabs, with 8-inch fab monthly production capacity increasing by 14% to a historic high of 7.7 million wafers. In response, UMC stated that from a supply and demand perspective, capacity growth still lags behind demand growth. UMC emphasized that it remains optimistic about the future of the 8-inch wafer market, thanks to ongoing advancements in special processes and differentiation.　　SEMI notes that the continuous rise in the penetration rate of electric vehicles (EVs) worldwide is driving substantial growth in the demand for inverters and charging stations. The future mass adoption of EVs is the primary driver for increased investments in 8-inch fabs and the continued expansion of global 8-inch fab capacity.　　Examining the situation of new 8-inch fabs in various countries, Southeast Asia will see the largest capacity increase, with a growth rate of approximately 32%. SEMI predicts that China’s 8-inch fab capacity will follow, with an increase of about 22%, reaching a monthly production capacity of 1.7 million wafers. The United States, Europe, the Middle East, and Taiwan are expected to have growth rates of approximately 14%, 11%, and 7%, respectively.　　SEMI reports that by 2023, China’s 8-inch fab capacity will account for approximately 22% of the global total, with Japan at around 16%, Taiwan at around 15%, and Europe, the Middle East, and the United States each at about 14%. Furthermore, to meet future market demand, suppliers such as Bosch, Infineon, Mitsubishi, Onsemi, and STMicroelectronics are accelerating their 8-inch fab capacity expansion. It is estimated that from 2023 to 2026, the 8-inch fab capacity for automotive and power semiconductors will increase by 34%.　　Concerns have been raised about potential oversupply as global 8-inch fabs expand, but UMC, a major semiconductor foundry, states that given the current rate of 8-inch fab expansion worldwide, the increase in capacity is relatively modest compared to demand. From a supply and demand perspective, it is certain that capacity growth will not keep pace with the growing global demand for 8-inch wafers.　　UMC further notes that while 8-inch fabs are increasing, demand is unlikely to remain stagnant. Currently, the majority of semiconductor fabs being built worldwide are 12-inch fabs, making the expansion of 8-inch fabs relatively limited, and the supply-demand balance has not worsened.

Key word：

fab

Release time：2023-09-22 16:08 reading：1734 Continue reading>>

Trade news

Nidec Instruments Launches New Semiconductor Wafer Transfer Robot

　　Nidec Instruments’ Latest Semiconductor Wafer Transfer Robot, SR7163 series.　　Despite a temporary slowdown in 2023, the global semiconductor market is expected to expand from 2024 after demand recovers in a wide variety of product groups such as memory logic and other IC products, and in the O-S-D (optoelectronics, sensor/actuator, and discrete semiconductor) segment. As the demand grows around the world for the construction of semiconductor factories with high production capacity, Nidec Instruments has developed the SR7163 series, a semiconductor wafer transfer robot to respond to its customers’ needs.　　Among semiconductor manufacturing equipment, the SR7163 series is expected to be used in batch-type thermal treatment equipment and other machines in processes that require to transfer multiple substrates to a stage with a different slot pitch. A product that utilizes an arm-link mechanism to move a hand horizontally, the SR7163 series boasts a small minimum turning radius that can accommodate narrow pitches of up to the minimum limit of 6.5mm. In addition, with the use of a highly airtight link-type arm, the SR7163 series meets ISO14644-1’s Class-1 cleanliness requirements, which is the industry’s highest-level cleanliness.　　As a member of the world’s leading comprehensive motor manufacturer, Nidec Instruments stays committed to offering revolutionary solutions that contribute to building a comfortable society.　　For more details on the above product, Please contact AMEYA360 official customer!

Key word：

Nidec

Release time：2023-09-05 13:49 reading：2733 Continue reading>>

Trade news

Global IC Wafer Shipments, Revenue Hit New Records in 2022

　　Setting new all-time highs, worldwide silicon wafer shipments in 2022 increased by 3.9% to 14,713 million square inches (MSI) while wafer revenue rose 9.5% to $13.8 billion over the same period, according to the year-end analysis of the silicon wafer industry by the SEMI Silicon Manufacturers Group (SMG).　　Last year’s 14,713 MSI total compared to 14,165 MSI shipped in 2021 as silicon wafers supported strong demand for semiconductor devices. Consumption of both 8-inch and 12-inch wafers increased, driven in part by the automotive, industrial, and IoT segments along with the 5G buildout. Wafer revenue reached $13,831 million, surpassing the record previously set in 2021.　　Annual Silicon* Industry Trends　　“The silicon wafer industry continued to advance despite mounting global macroeconomic concerns,” said Anna-Riikka Vuorikari-Antikainen, Chairman of SEMI SMG and Chief Commercial Officer at Okmetic. “Silicon shipments have grown in nine out of the last 10 years, a testament to silicon’s central role in the vital semiconductor industry.”　　Data cited include polished silicon wafers such as virgin test and epitaxial silicon wafers, as well as non-polished silicon wafers shipped to end users.

Key word：

IC

Release time：2023-02-09 15:43 reading：1824 Continue reading>>

Trade news

Cree Signs $250 Million Deal to Supply ST With SiC Wafers

Cree has signed a multi-year $250 million agreement to produce and supply its Wolfspeed 150-mm silicon-carbide (SiC) bare and epitaxial wafers to STMicroelectronics. The supply agreement is for ST’s silicon-carbide products in the broad automotive and industrial markets.Jean-Marc Chery, president and CEO of STMicroelectronics, said that ST is the only semiconductor company with automotive-grade silicon carbide in mass production today and that the company wants to press forward to grow its SiC business both in terms of volume and breadth of applications served. As ST had previously stated during an earnings announcement, its aim is to take the lead in a market estimated to be worth more than $3 billion in 2025.“This agreement with Cree will improve our flexibility, sustain our ambition and plans, and contribute to boosting the pervasion of SiC in automotive and industrial applications," Chery said.This is the third multi-year agreement that Cree has signed in the past year for its 150-mm silicon-carbide wafers. In February 2018, it announced a $100 million long-term supply agreement for its SiC wafers to Infineon Technologies for product lines including photovoltaic inverters, robotics, charging infrastructure, industrial power supplies, traction, and variable speed drives.In October 2018, it announced an $85M long-term agreement to produce and supply its SiC wafers to an unnamed “leading power device company.”

Key word：

Cree,ST

Release time：2019-01-10 00:00 reading：2671 Continue reading>>

Trade news

Cree and STMicroelectronics Announce Multi-Year Silicon Carbide Wafer Supply Agreement

Cree announces that it signed a multi-year agreement to produce and supply its Wolfspeed silicon carbide (SiC) wafers to STMicroelectronics. The agreement governs the supply of a quarter billion dollars of Cree's advanced 150mm silicon carbide bare and epitaxial wafers to STMicroelectronics during this period of extraordinary growth and demand for silicon carbide power devices."ST is the only semiconductor company with automotive-grade silicon carbide in mass production today, and we want to press forward to grow our SiC business both in terms of volume and breadth of applications served, targeting leadership in a market estimated at more than $3B in 2025," said Jean-Marc Chery, president and CEO of STMicroelectronics. "This agreement with Cree will improve our flexibility, sustain our ambition and plans, and contribute to boosting the pervasion of SiC in automotive and industrial applications.""We remain focused on increasing the adoption of silicon carbide-based solutions, and this agreement is a testament to our mission," said Gregg Lowe, CEO of Cree. "This is the third multi-year agreement that we have signed this past year in support of the industry's transition from silicon to silicon carbide. As the world leader in silicon carbide, Cree continues to expand capacity to meet the growing market needs, particularly in industrial and automotive applications. We are extremely pleased to continue to support STMicroelectronics as we both invest to accelerate this market."

Key word：

Cree,STMicroelectronics

Release time：2019-01-09 00:00 reading：3026 Continue reading>>

model	brand	Quote
TL431ACLPR	Texas Instruments
BD71847AMWV-E2	ROHM Semiconductor
MC33074DR2G	onsemi
CDZVT2R20B	ROHM Semiconductor
RB751G-40T2R	ROHM Semiconductor

model	brand	To snap up
TPS63050YFFR	Texas Instruments
IPZ40N04S5L4R8ATMA1	Infineon Technologies
STM32F429IGT6	STMicroelectronics
BP3621	ROHM Semiconductor
BU33JA2MNVX-CTL	ROHM Semiconductor
ESR03EZPJ151	ROHM Semiconductor

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